首页分享镍基单晶高温合金瞬态液相连接接头的微观结构和结晶学取向

镍基单晶高温合金瞬态液相连接接头的微观结构和结晶学取向

来源：花匠小妙招时间：2025-08-30 22:39

镍基单晶高温合金瞬态液相连接接头的微观结构和结晶学取向1.沈阳理工大学材料科学与工程学院
2.中国科学院金属研究所MICROSTRUCTURE CHARACTERISTICS AND CRYSTALLOGRAPHIC ORIENTATION OF TRANSIENT LIQUID PHASE JOINT OF NI-BASE SINGLE CRYSTAL SUPERALLOYLI Wen1;2; JIN Tao2; HU Zhuangqi21.College of Materials Science and Engineering; Shenyang Ligong University
2.Institute of Metal Research; Chinese Academy of Sciences引用本文:

李文金涛胡壮麒. 镍基单晶高温合金瞬态液相连接接头的微观结构和结晶学取向[J]. 金属学报, 2008, 44(12): 1474-1478.
, , .MICROSTRUCTURE CHARACTERISTICS AND CRYSTALLOGRAPHIC ORIENTATION OF TRANSIENT LIQUID PHASE JOINT OF NI-BASE SINGLE CRYSTAL SUPERALLOY[J]. Acta Metall Sin, 2008, 44(12): 1474-1478.

摘要参考文献相关文章 Metrics摘要:

采用Ni-15Cr-3.5B非晶合金箔带作为中间层合金对镍基单晶高温合金进行瞬态液相(TLP)连接. 利用光学显微镜、扫描电镜、透射电镜对接头的微观结构进行观察和分析, 利用电子背散射衍射(EBSD)方法测定了连接区域和基体之间的结晶学取向. 结果表明, 接头区域由连接区、中间金属/基体金属界面扩散区和基体金属区组成, 连接区中心形成M23B6+γ和MB+γ 共晶, 扩散区形成细小的M3B2颗粒; 均匀化处理后接头与基体的γ'相的尺寸趋于一致; TLP接头等温凝固过程中, 固/液界面向液相移动中外延生长, 连接层与所连接的基体金属的结晶学取向一致.

关键词：镍基单晶高温合金, TLP连接, 微观结构, 结晶学取向 Abstract：

The Ni-based single crystal superalloy was bonded by the transient liquid phase (TLP) bonding using Ni-15Cr-3.5B amorphous ribbon as an insert alloy. The microstructure characteristics in the joint during TLP process were evaluated by OM, SEM and TEM. The electron back scattering diffraction (EBSD) method was applied to determine the crystallographic orientation between the bonded interlayer and substrates. The results indicated that the joint consists of a bond, diffusion and base zones, in the meantime M23B6 +γ and MB+γ eutectics formed in the bond center and the fine M3B2 phases occurred in the diffusion zone. The γ' phases both in the bonded interlayer and in the superalloy substrate are almost identical after homogenization treatment. Due to the epitaxial growth of the isothermal solidification fronts from each mating surface, the crystallographic orientation between the bonded interlayer and the bonded substrate has a good match.

Key words：Ni-based single crystal superalloy TLP bonding;microstructure crystallographic orientation收稿日期: 2008-05-29 基金资助:

国家自然科学基金资助项目50474058

服务把本文推荐给朋友加入引用管理器 E-mail AlertRSS作者相关文章李文金涛胡壮麒

[1]Yeh M S,Chuang T H.Weld J,1997;76:517
[2]Gale W F,Butts D A.Sci Technol Weld Join,2004;9: 283
[3]Duvall D S,Owczarski W A,Paulonis D F.Weld J,1974; 20:203
[4]Kim D U,Nishimoto K.Met Mater Int,2002;8:403
[5]Tetsuro T,Taka O E.J Mater Sci,1996;31:2461
[6]Nishimoto K,Saida K,Kim D,Asai S,Furukawa Y,Nakao Y.Weld World,1998;41:121
]7]Tuah-Poku I,Dollar M,Massalski T B.Metall Trans, 1998;19A:675
[8]Wikstrom N P,Ojo O A,Chaturvedi M C.Mater Sci Eng, 2006;A417:299
[9]Li X H,Mao W,Cheng Y Y.In:Wang S Y,Wang L S, eds.,Proceeding of the 8th Welding Conference,Beijing: China Machine Press,1997:318 (李晓红，毛唯，程耀永．见：王守业，王麟书主编，第八次全国焊接会议论文集，北京：机械工业出版社，1997：318)
[10]Li W,Jin T,Sun X F,Guo Y,Guan H R,Hu Z Q.Acta Metall Sin,2001;37:1165 (李文，金涛，孙晓峰，郭义，管恒荣，胡壮麒．金属学报，2001；37：1165)
[11]Li W,Jin T,Sun X F,Guo Y,Guan H R,Hu Z Q.Scr Mater,2003;48:1283
[12]Liu J D,Jin T,Zhao N R,Wang Z H,Sun X F,Guan H R,Hu Z Q.Sci Technol Weld Join,2007;12:381

ViewedFull text

Abstract

Cited

Shared Discussed